Facilities and Equipment

The Nanoscale Fabrication and Characterization Facility

PINSE supports the Nanoscale Fabrication and Characterization Facility (NFCF), a 4,000-ft² cleanroom user facility located in the sub-basement of Benedum Hall. The facility is divided into two sections, Characterization and Fabrication (Cleanroom).

New User? See the sign up process here.

Click here for a map of the facility.

Characterization Dual Beam System FEI Scios Focused Ion Beam/Scanning Electron Microscope with EDAX Pegasus Hikari Super Energy Dispersive Spectrometer and Electron Backscatter Diffraction  Electron Microscopes: Apreo Scanning Electron Microscope with EDAX EDS and EBSD Zeiss Sigma 500 VP Analytical FE-SEM with Oxford Microanalysis JEOL JEM-2100F Transmission Electron Microscope (TEM) Electron Probe Micro Analyzer (EPMA) Enviromental Transmission Electron Microscope (ETEM) FEI Titan Themis G2 200 Probe Cs Corrected Scanning Transmission Electron Microscope (STEM) Scanning Probe Microscopy Dimension Icon Atomic Force Microscope (AFM) Thermal Analysis TA Instruments Discovery DSC250 Differential Scanning Calorimeter (DSC) (Room 620) STA 6000 - Simultaneous Thermal Analyzer (TGA/DSC) (Room 620) Spectroscopy Fourier Transform Infrared Spectroscopy (FT-IR) Spectroscopic Phase Modulated Ellipsometer Optical Microscope (Zeiss software Cleanroom) Raman Microscope Raman Microscope: Renishaw inVia X-Ray Diffraction X-Ray Diffractometer (XRD) Sample Preparation Denton Sputter Coater for SEM Sample Prep PDMS Preparation Area Fischione 130 Specimen Punch Fischione 180 XTEM Prep Kit Fischione 1040 NanoMill Fischione 1050 TEM Mill Fischione 1060 Ion Mill Fischione 1070 NanoClean Plasma Cleaner Fischione 110 Twin Jet Electropolisher Fischione 160 Specimen Grinder Fischione 170 Ultrasonic Disk Cutter Fischione 200 Dimpling Grinder Fischione 9020 Vacuum Storage Station

Fabrication (Cleanroom) Lithography Electron Beam Lithography System: Raith e-LiNE (EBL) Heidelberg MLA100 Direct Write Lithographer  Mask Aligner – Quintel Q4000 MA Mask Aligner – Suss MJB-3 YES HMDS Oven Zeiss Axio Imager Motorized Optical Microscope Nanoscribe 3D Lithography System Thin Film Deposition Plasma Enhanced Chemical Vapor Deposition (PECVD) Thermionics Electron Beam Evaporator System (EBE) Hybrid Sputter/Evaporation System (Deposition System AJA) Plassys E-Beam Evaporation System  Plasma Enhanced Atomic Layer Deposition (PE-ALD) Angstrom Sputtering System Pulse Laser Deposition System (PLD) (Room 620 BEH)* Parylene Deposition Coater - PDS 2010 (Room 620 BEH)* Dry Etching Trion Reactive Ion Etcher (RIE) APEX ICP-RIE Etcher Chlorine APEX ICP-RIE Etcher Fluorine Plasma Asher (March500) Surface Profiler Surface Profiler: Bruker DektakXT Thermal Processing Rapid Thermal Annealer (Solaris 100) Oxidation/Annealing Tube Furnace Hoods All Hoods Dicer Disco DAD321 Dicing Saw (Room SB02A)*     * Equipment in rooms 620 and SB02A do not require cleanroom access.

To gain access to above listed equipment, complete the orientation steps described under Become a User after which you can sign up for an equipment training.

If you would like to review the general demand of each each equipment, you can use our equipment schedule viewing tool here.