Facilities and Equipment

The Nanoscale Fabrication and Characterization Facility

PINSE supports the Nanoscale Fabrication and Characterization Facility (NFCF), a 4,000-ft² cleanroom user facility located in the sub-basement of Benedum Hall. The facility is divided into two sections, Characterization and Fabrication (Cleanroom).

New User? See the sign up process here.

Characterization Dual Beam System FEI Scios Focused Ion Beam/Scanning Electron Microscope with EDAX Pegasus Hikari Super Energy Dispersive Spectrometer and Electron Backscatter Diffraction  Electron Microscopes: Zeiss Sigma 500 VP Analytical FE-SEM with Oxford Microanalysis JEOL Scanning Electron Microscope (SEM) JEOL JEM-2100F Transmission Electron Microscope (TEM) Electron Probe Micro Analyzer (EPMA) Enviromental Transmission Electron Microscope (ETEM) FEI Titan Themis G2 200 Probe Cs Corrected Scanning Transmission Electron Microscope (STEM) Scanning Probe Microscopy Scanning Probe Microscopy Station (SPM/AFM) Differential Scanning Calorimeter TA Instruments Discovery DSC250 Differential Scanning Calorimeter (DSC) (Room 620) Spectroscopy Fourier Transform Infrared Spectroscopy (FT-IR) Microspectrophotometer (MSP) Spectroscopic Phase Modulated Ellipsometer Optical Microscope Raman Microscope Raman Microscope: Renishaw inVia X-Ray Diffraction X-Ray Diffractometer (XRD) Sample Preparation Sputter Coater for SEM Sample Preparation Plasma Cleaner PDMS Preparation Area

Fabrication (Cleanroom) Lithography Electron Beam Lithography System: Raith e-LiNE (EBL) Heidelberg MLA100 Direct Write Lithographer  Mask Aligner – Quintel Q4000 MA Mask Aligner – Suss MJB-3 YES HMDS Oven Zeiss Axio Imager Motorized Optical Microscope Nanoscribe 3D Lithography System Thin Film Deposition Plasma Enhanced Chemical Vapor Deposition (PECVD) Thermionics Electron Beam Evaporator System (EBE) Hybrid Sputter/Evaporation System (Deposition System AJA) Plassys E-Beam Evaporation System  Plasma Enhanced Atomic Layer Deposition (PE-ALD) Angstrom Sputtering System Pulse Laser Deposition System (PLD) (Room 620 BEH) Dry Etching Trion Reactive Ion Etcher (RIE) APEX ICP-RIE Etcher Chlorine APEX ICP-RIE Etcher Fluorine Plasma Asher (March500) Surface Profiler Surface Profiler: KLA Tencor Alpha-Step IQ Thermal Processing Rapid Thermal Annealer (Solaris 100) Oxidation/Annealing Tube Furnace Hoods All Hoods Dicer Disco DAD321 Dicing Saw(Room SB02A)